An Introduction to Mixed-Signal IC Test and Measurement by Gordon Roberts, Friedrich Taenzler, Mark Burns

By Gordon Roberts, Friedrich Taenzler, Mark Burns

With the proliferation of advanced semiconductor units containing electronic, analog, mixed-signal, and radio-frequency circuits, cutting-edge engineer needs to be fluent in all 4 circuit forms. Written for complicated undergraduate and graduate-level scholars, in addition to engineering pros, An Introduction to Mixed-Signal IC attempt and Measurement, moment version, encompasses analog, mixed-signal and radio-frequency circuits checks, with many proper commercial examples. The textual content assumes a fantastic historical past in analog and electronic circuits and a operating wisdom of desktops and desktop programming.

An creation to Mixed-Signal IC attempt and Measurement, moment version, contains examples and illustrations--featuring state of the art business technology--to improve and brighten up the textual content. The publication additionally introduces large-scale mixed-signal circuit and person circuit assessments, discusses the value-added advantages of mixed-signal IC trying out to a manufacturer's product, and obviously defines the function of the try engineer.

New to This Edition
* a brand new bankruptcy on RF try tools and basics of RF Testing
* a brand new bankruptcy on Clock and Serial info Communications Channel Measurements
* assurance of RF load board design
* New assurance of probabilistic reasoning for mixed-signal trying out

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In addition, the injection-molded plastic introduces mechanical stresses in the silicon, which may consequently introduce DC voltage shifts. Final testing also guarantees that the bond pads are all connected and that the die was not cracked, scratched, or otherwise damaged in the packaging process. After final testing, the devices are ready for shipment to the end-equipment manufacturer. 2 Characterization Versus Production Testing When prototype devices are first characterized, the ATE test program is usually very extensive.

Final testing guarantees that the performance of the device did not shift during the packaging process. For example, the insertion of plastic over the surface of the die changes the electrical permittivity near the surface of the die. Consequently, traceto-trace capacitances are increased, which may affect sensitive nodes in the circuit. In addition, the injection-molded plastic introduces mechanical stresses in the silicon, which may consequently introduce DC voltage shifts. Final testing also guarantees that the bond pads are all connected and that the die was not cracked, scratched, or otherwise damaged in the packaging process.

The test cost reduction responsibility is shared with the product engineer. The product engineer’s primary role is to support the production of the new device as it matures and proceeds to profitable volume production. The product engineer helps identify and correct process defects, design defects, and tester hardware and software defects. Sometimes the product engineering function is combined with the test engineering function, forming a single test/product engineering position. The advantage of the combined job function is that the product engineering portion of the job can be performed with a much more thorough understanding of the device and test program details.

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